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(June 6)Multiphysics Modeling in Computational Electromagnetics: Challenges and Opportunities (IEEE AP-S Distinguished Lecture)

Time: May 31, 2016

时间 地点
人物

Title:

Multiphysics  Modeling in Computational Electromagnetics: Challenges and Opportunities (IEEE  AP-S Distinguished Lecture)

Lecturer:

Prof.  JIN Jian-Ming

Time:

15:00, June 6, 2016

Venue:

J110, North Campus

Lecturer  Profile

Jian-Ming  Jin is Y. T. Lo Chair Professor in Electrical and Computer Engineering and  Director of the Electromagnetics Laboratory and Center for Computational  Electromagnetics at the University of Illinois at Urbana-Champaign. He has  authored and co-authored over 250 papers in refereed journals and over 20 book  chapters. He has also authored The Finite Element Method in Electromagnetics,  Electromagnetic Analysis and Design in Magnetic Resonance Imaging, and Theory  and Computation of Electromagnetic Fields, co-authored Computation of Special  Functions, Finite Element Analysis of Antennas and Arrays, and Fast and  Efficient Algorithms in Computational Electromagnetics. His name often appeared  in the University of Illinois’s List of Excellent Instructors. He was elected  by ISI among world’s most cited authors in 2002. He is a Fellow of IEEE,  Applied Computational Electromagnetics Society (ACES), and Electromagnetics  Academy. Recently, he received the 2014 ACES Technical Achievement Award, 2015  IEEE Antennas and Propagation Society Chen-To Tai Distinguished Educator Award,  and 2016 ACES Computational Electromagnetics Award.

Lecture  Abstract

As  computational methods for solving Maxwell’s equations become mature, the time  has come to tackle much more challenging multiphysics problems, which have a  great range of applications in sciences and technologies. In this presentation,  we will use five examples to illustrate the nature and modeling of multiphysics  problems. The first example is related to electromagnetic hyperthermia, which  requires solving electromagnetic and bio-heat transfer equation for the  planning and optimization of the treatment process. The second concerns the  heat problem in integrated circuits due to electromagnetic dissipated power,  which requires an electrical-thermal co-simulation. The third example considers  modeling of monolithic microwave integrated circuits, which consist of both  distributive and lumped circuit components. The fourth is the simulation of  vacuum electronic devices using the particle-in-cell method, which solves  Maxwell’s equations and particle kinetic equation, and the last example  simulates the air and dielectric breakdown in high-power microwave devices by  coupling electromagnetic modeling with various plasma models. With these  examples, we will discuss the methodologies and some of the challenges in  multiphysics modeling.

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