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(August 2)Bringing Cores Closer Together: The Wireless Revolution in On-Chip Communication

Time: Sep 6, 2016

时间 地点
人物

Title:

Bringing  Cores Closer Together: The Wireless Revolution in On-Chip Communication

Lecturer:

Prof. Partha  Pratim Pande

Time:

10:00, August 2,  2016

Venue:

609, New  Science and Technology Building, North Campus

Lecturer  Profile

Partha  Pratim Pande is a Professor and holder of the Boeing Centennial Chair in  computer engineering at the school of Electrical Engineering and Computer  Science, Washington State University, Pullman, USA. His current research  interests are novel interconnect architectures for manycore chips, on-chip  wireless communication networks, and hardware accelerators for biocomputing.  Dr. Pande currently serves as the Editor-in-Chief (EIC) of IEEE Transactions on  Multi-Scale Computing Systems (TMSCS) and Associate Editor-in-Chief (A-EIC) of  IEEE Design and Test (D&T). He is on the editorial boards of IEEE  Transactions on VLSI (TVLSI), ACM Journal of Emerging Technologies in Computing  Systems (JETC) and Sustainable Computing: Informatics and Systems (SUSCOM). He  was the technical program committee chair of IEEE/ACM Network-on-Chip Symposium  2015. He also serves in the program committee of many reputed international  conferences. He has won the NSF CAREER award in 2009. He is the winner of the  Anjan Bose outstanding researcher award from the college of engineering,  Washington State University in 2013.

Lecture  Abstract

The  continuing progress and integration levels in silicon technologies make  complete end-user systems on a single chip possible. This massive level of integration  makes modern many core chips all pervasive in domains ranging from weather  forecasting, astronomical data analysis, and biological applications to  consumer electronics and smart phones. Network-on-Chips (NoCs) have emerged as  communication backbones to enable a high degree of integration in many core  platforms. Despite their advantages, an important performance limitation in  traditional NoCs arises from planar metal interconnect-based multi-hop  communications, wherein the data transfer between far-apart blocks causes high  latency and power consumption. The latency, power consumption, and interconnect  routing problems of NoCs can be simultaneously addressed by replacing multi-hop  wired paths with high-bandwidth single-hop long-range wireless links. In this  talk, we will present design of the millimeter (mm)-wave wireless NoC  architectures. We will present detailed performance evaluation and necessary  design trade-offs for the small-world network-enabled wireless NoCs with  respect to their conventional wireline counterparts in presence of both  conventional CMP and emerging big data workloads. We will discuss how Machine  Learning can be exploited to design energy efficient Wireless NoC  architectures. We will finish this presentation by discussing how the wireless  NoC paradigm can enable realization of datacenter-on-chip using heterogeneous  processing cores.

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