The origin of School of Mechano-Electronic Engineering (SMEE) can be traced back to the Department of Radar Technology founded in 1960, which was renamed the Department of Electronic Mechanism in 1979 and the School of Electronic Mechanism in 1994, respectively. In 1999, the School of Electronic Mechanism, the Department of Detection and Instrumentation, and three teaching and research offices from the School of Electronic Engineering including the Industrial Automation, Automatic Control, and Electrical Technology merged into SMEE, which created a unique, interdisciplinary hub designed to tackle the complex challenges at the intersection of hardware and intelligence.
The SMEE is supported by a robust team of 241 faculty and staff. This includes a distinguished group of 65 PhD supervisors and a strong professoriate of 42 full professors and 99 associate professors. Our faculty's excellence is recognized by numerous prestigious appointments and honors, including one Academician of the Chinese Academy of Engineering, 8 National-level Talents, and 4 National-level Young Talents. The school is also home to 3 IEEE Fellows, 1 IET Fellow, 1 IAAM Fellow, 4 members of the National Teaching Education Steering Committee, and 6 professors enjoying special government allowance. Further strengthening our research are 19 Provincial/Ministerial-level Talents, 4 Provincial-level Scientific and Technological Innovation Teams, and 4 German Humboldt Research Fellows. The SMEE has a vibrant student community of over 3,300, comprising 2,150 undergraduates and 1,170 postgraduates. Our graduate programs include 980 master's degree candidates and 190 doctorate candidates.
The SMEE has 7 bachelor programs (6 selected as National First-Class Undergraduate Major Construction Site), 5 first-level disciplines authorized to offer master degree, 4 first-level disciplines authorized to offer doctorate degrees, and 3 post-doctoral research centers. The SMEE has 4 disciplines including Mechanical engineering, Control Science and Engineering, Instrument Science and Technology, Electrical Engineering, and Mechanics. The Electronic Mechanical Engineering has made a major breakthrough in the fifth round of national discipline evaluation by being promoted to the A category of disciplines.
The SMEE fosters a global and industry-oriented outlook through strategic partnerships. Academically, SMEE offers joint degree programs with leading international institutions including the Stevens Institute of Technology, the University of Cincinnati, and the University of Chester, providing students with a world-class education. Our collaborative network extends to research cooperation with prestigious universities such as the University of Manchester and the Conservatoire national des arts et métiers (CNAM). Furthermore, SMEE has established in-depth industry-university-research partnerships with major coastal economic hubs, including Kunshan, Zhenjiang, and Xiaoshan, ensuring our research translates into real-world impact.
The SMEE strongly supports faculty to actively develop international cooperation and exchanges. Over the past five years, the number of academic exchanges and visiting scholars abroad has exceeded 300, and more than 40 important international academic conferences have been hosted/organized. SMEE is committed to building an undergraduate visiting program in summer vacation — New CDIO (Collaboration + Discovery + Internationalization = Opportunity) Global Learning Program. In the past three years, SMEE has cooperated with several well-renowned universities in the United States, Britain, Japan, and Singapore. The number of visiting students has exceeded 200, which has become a symbol for the international initiatives of Xidian University.
Building upon the formidable disciplinary strength of the School of Mechano-Electronic Engineering, the State Key Laboratory of Electromechanical Integrated Manufacturing of High-performance Electronic Equipment was established to address foundational challenges in the field. The laboratory is dedicated to solving key theoretical and technological bottlenecks in "mechatronic integrated manufacturing" that hinder the advancement of high-performance electronic equipment. From a multidisciplinary and systems-level perspective, it investigates the multi-field, multi-domain, and cross-scale coupling mechanisms—encompassing mechanical structures, electromagnetism, and heat transfer—that occur during the design, manufacturing, and service life of this equipment. This research has enabled breakthroughs in key digital manufacturing, high-density packaging, assembly, and testing technologies. These advances are validated by 23 landmark achievements, most notably the prestigious First Prize of the National Science and Technology Progress Award.
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